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Selected Papers from DMSMS 1999

For the full on-line Proceedings go to Proceedings of the 1999 Diminishing Manufacturing Sources and Material Shortages (DMSMS) Conference.


Obsolete Processor Replacement Options

Derek Maddox
Ball Aerospace & Technologies Corporation, Aerospace Systems Division

benoit_s.pdf
benoit_p.pdf

Background (excerpt)
Processor obsolescence is becoming an increasingly vexing problem for embedded computer users.  From military and civilian aircraft, to manufacturing facilities, to air traffic control facilities, aging computer systems present a variety of problems. Sometimes the problem is diminishing availability of spare parts for computer repair. At other times the problem is the inability of the processor to absorb new requirements because of limited processor throughput or memory. Regardless how the problem manifests itself, a solution, which is often proposed, is to replace the processor with a more modern piece of equipment. This solution certainly answers the problem with hardware, but leaves the question of what to do with the software which the processor runs.


Design
Criteria to Mitigate Obsolescence in Future Design Criteria to Mitigate Obsolescence in Future Designs

Keith Bergevin

bergevin.pdf


Presentation Roadmap

Understanding the Real DMS Design Issues

  • Vision into the Future: Technology Trends

    • Today’s vs. Tomorrow’s Technology

    • Potential Impact of Advanced Technologies on the DMS World

  • Additional Potential Adverse DMS Factors

Design Recommendations for Mitigating Future Obsolescence


PEM Up-Rating Evaluation

Tom Davidson
davidson.pdf

Subject Outline

  • NSWC-Crane PEM Evaluation History

  • Major Revision with Commercial Insertion

    • Parts Derating Requirements and Application Manual for Navy Electronic Equipment

  • PEM Up-Rating Evaluation

  • PEM Assessment Failures & Anomalies

  • Using PEMs in Military Applications


Advanced Microcircuit Emulation (AME) Program – Developing Next Generation Emulation Technology

Harvey M. Hanson, Space and Naval Warfare Systems Center, San Diego, CA; Donald F. O’Brien, Alex Melnikow, Defense Logistics Agency, Ft. Belvoir, VA; James S. Crabbe, Les R. Avery, Sarnoff Corporation, Princeton, NJ

hanson_s.pdf
hanson_p.pdf

Abstract
This paper presents the Advanced Microcircuit Emulation (AME) Program, a Defense Logistics Agency (DLA) managed tri-service effort that is developing the next generation of form, fit, and function (FFF) microcircuit emulation capability. This program is operated independently from the Defense Supply Center’s (DSCC) Generalized Emulation of Microcircuits (GEM) Production Program. AME’s technology scope includes advanced digital devices, microprocessors/microcontrollers, memory, analog, hybrids, and assemblies employing AME technologies. The paper begins with a brief review of the program’s background and drivers. It continues by detailing AME’s program structure, current status, and concludes with future plans.

Redesign and Testing of Obsolete ASICs

lau.pdf


Presentation Roadmap

  • Understanding the Difficulty of Obsolete ASIC Redesign

  • Developing an Accurate Redesign Specification

  • ASIC Redesign and Testing

  • ASIC Prototype Testing

  • Fabrication and Packaging

COTS/ROTS For Mission-Critical Systems

T. A. KRINKE and D. K. PAI

GENERAL DYNAMICS INFORMATION SYSTEMS

pai_s.pdf
pai_p.pdf

ABSTRACT

Three major benefits of using commercial-off-the-shelf (COTS) products to meet defense needs are: 1) reduces overall cost of the military hardware; 2) enhances the defense supplier base; and 3) maintains technological superiority by leveraging state-of-the-art technology rapidly. However, inadequate information on realistic military operating environments, insufficient data on commercial product performance and lack of proven reliability assessment tools makes low-risk insertion of COTS components into ruggedized, mission-critical, defense applications very difficult.

General Dynamics Information Systems (GDIS) has been pursuing COTS technology, including plastic encapsulated microelectronics (PEM), for its military business for the past four years. GDIS has also joined Computer-Aided Life-Cycle Engineering (CALCE) Electronic Packaging Research Center (EPRC), University of Maryland, to participate in the research activities on PEMs, interconnect and reliability. During 1996, we successfully completed a CRAD project on PEMs, teamed with a major customer to analyze reliability of large-die-size COTS/PEMs for avionics applications, and inserted.  COTS into several products. In addition, we have developed several innovative techniques to convert COTS into ruggedized-off-the -shelf (ROTS) products, and applied for patents.

This paper presents an overview of development conducted at GDIS on COTS, PEMs, ROTS, and reliability. A general discussion on the analytical techniques, design modifications, design for manufacturability, manufacturing processes, accelerated life testing (ALT), non-destructive testing (NDT), and reliability assessment for high performance electronic modules will be provided. It is intended that this will broaden the base of information on COTS, PEM, ROTS, electronic materials, NDT, and reliability assessment of military and commercial circuit card assemblies. Although GDIS conducted these research activities to improve reliability of military circuit card assemblies, this technology can be used for any commercial applications requiring high reliability.


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Last Revised: December 25, 2002
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