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Analysis of JPL Bond Pull Data

Device: RT52SX32S-CQ256E
Date Code: 0113
Lot: T25JSP03

Bond Pull Data Taken From: dpa_sx32s_ldc0113_t25jsp03.pdf (Acrobat 4 needed)

S/N	Number of Tests	Average Pull Strength (gf)	Standard Deviation (gf)	Min (gf)	Max (gf)	Max-Min (gf)
0127	289	5.81	0.60	4.4	11.3	6.9
0147	289	5.50	0.42	3.5	7.2	3.7
0194	285	5.42	0.35	4.6	6.2	1.6
Totals	863	5.58	0.49	3.5	11.3	7.8

Histograms of Bond Wire Strength

Full histogram

Zoomed in

Failure Category Summary

A.
B.
C.
D.
E.
F. 4
G. 2
H. 17
J. 844
K.
X.

Bond Test Pull Legend

A. No break up to ________ grams.
B. Bond lifts from die.
C. Bond lifts from post.
D. Bond lifts from substrate.
E. bond removes underlying metallization.
F. No connection.
G. Wire breaks at die/heel.
H. Wire breaks at post/heel
J. Wire breaks at span.
K. Wire breaks at substrate/heel
X. Bond damaged prior to testing.

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Last Revised: May 16, 2002
Digital Engineering Institute
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