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A scientific study of the problems of digital engineering for space flight systems,
with a view to their practical solution.

Actel Bond Pull Data

Wire Bond Failure Categories per MIL-STD-883C, Method 2011

RT54SX72SCQ208, Date Code 0206, Lot Code T25K2005

RT54SX32SCQ256, Date Code 0151, Lot Code T25JS001

#RT54SX72SCQ256, Date Code 0151, Lot Code T25KS005

RT54SX72S-CQ208B
T25K2005
D/C 0206

t25ks005_0206.pdf - full report (scanned in)

Tests: Resistance to Solvents, Solderability, Bond Strength, Bond Pull, Inspection

Six Devices Tested.  The data is presented in two groups.

S/N	Number of Tests	Average Pull Strength (gf)	Standard Deviation (gf)	Standard Deviation (%)	Mean - 3StdDev (gf)	Min (gf)	Max (gf)	Max-Min (gf)
7292	4	6.6	1.3	19.7	2.7	5.0	8.2	3.2
7371	4	6.7	0.7	10.4	4.6	5.7	7.3	1.6
7428	4	6.3	1.2	19.0	2.7	4.7	7.5	2.8
7450	3	6.8	0.8	11.8	4.4	6.0	7.5	1.5
Totals	15	6.4	0.9	14.1	3.7	4.7	8.2	3.5

Failure Category Summary, per MIL-STD-883C, Method 2011

1. 4
2. 11
3. 0
4. 0
5. 0
6. 0
7. 0
8. 0

Histogram of Bond Wire Strength

Failure Category Summary, per MIL-STD-883C, Method 2011

1. 58
2. 438
3. 0
4. 0
5. 0
6. 0
7. 0
8. 0

Histogram Data (can't read it all so no chart for now, requested better copy of the data)

Bond Wire Pull Strength (gf)	Number of Bonds
2.0	0
2.5	1
3.0	1
3.5	4
4.0	5
4.5	7
5.0	12
5.5	12
6.0	40
6.5	170
7.0	144
7.5	74
8.0	22
8.5	?
9.0	?
9.5	?

RT54SX32S-CQ256B
T25JS001
D/C 0151

rt54sx32s_0151_grp_b_100_pull.pdf full report (scanned in)

RT54SX72S-CQ256B
T25KS005
D/C 0151

rt54sx72s_0151_grp_b_100_pull.pdf

Wire Bond Failure Categories per MIL-STD-883C, Method 2011

1. Wire break at neckdown point
2. Wire break at any other point
3. Failure in bond interface at die
4. Failure in bond interface at substrate, post or other than die
5. Lifted metallization from die
6. Lifted metallization from substrate or post
7. Fracture of die
8. Fracture of substrate

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Last Revised: May 15, 2002
Digital Engineering Institute
Web Grunt: Richard Katz