NASA Office of Logic Design

A scientific study of the problems of digital engineering for space flight systems,
with a view to their practical solution.

Destructive Physical Analysis (DPA)

RTAX1000S, D/C 0546

January, 2006

Summary

Three RTAX1000S FPGAs were sent to Hi-Rel Laboratories for a destructive physical analysis (DPA), focusing on a SEM examination of the bond wire to die interface and pull tests.  The testing was performed in accordance with GSFC S-311-M-70, MIL-STD-1580B REQ. 16.1, MIL-STD-883 Method 5009, and applicable military standards.

No problems were observed.

Device Information

Part Number:     RTAX1000S
Package:         CQ352
Grade:           B
Lot Date Code:   0546
Wafer Date Code: ??????
S/N:             ?????

Sample SEM Images of Wire Bonds and Bond Pull Data

Image
Hi-Rel Sample Number	92006 Data Sheet	92031 Data Sheet	92068 Data Sheet
Actel S/N

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