NASA Office of Logic Design

A scientific study of the problems of digital engineering for space flight systems,
with a view to their practical solution.

RTAX1000S Destructive Physical Analysis (DPA)

December, 2005

Summary

Two RTAX1000S FPGAs were sent to Hi-Rel Laboratories for a destructive physical analysis (DPA).  The testing was performed in accordance with GSFC S-311-M-70, MIL-STD-1580B REQ. 16.1, MIL-STD-883 Method 5009, and applicable military standards.

Issues were found with the wire bonds on the first device, S/N 61287, and the analysis was stopped.  Additional devices have been sent to DPA Laboratories for analysis.

Device Information

Part Number:     RTAX1000S
Package:         CQ352
Grade:           B
Lot Date Code:   0444
Wafer Date Code: D1GAH1
S/N:             61287

Report and Images

DPA Report

The pictures below are of higher quality then the corresponding images in the .pdf file above.

die shots, nice color

die shots, with and without pin numbers

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The following files originally came in a .tif format and were converted to .jpg  (will post when they come in).

 xray shots

Sample SEM Images of Wire Bonds

 

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