(MAPLD Conference)
PAB8: Jeffery Banker
Pico Technology, Inc.
"Quick-Turn MCMs in a 3-D Stack"
Technology for a 3-D stack of MCMs has been developed to significantly reduce the size of spacecraft systems and subsystems. The critical enhancement offered by the 3-D approach is the integration of a quick-turn, programmable multichip module substrate technology within the MCM stack. This highly integrated electronic packaging concept will support various critical applications such as Command and Data Handling (C&DH), volatile and nonvolatile memory subsystems, and complex science experiments. The programmable substrates will allow rapid, low-cost integration of these custom functions within 3-D stacks in spacecraft, aircraft, or ground vehicles.
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Last Revised: July 03, 2002
Digital Engineering Institute
Web Grunt: Richard Katz
