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A scientific study of the problems of digital engineering for space flight systems,
with a view to their practical solution.


1998 Military and Aerospace Applications of

Programmable Devices and Technologies Conference

(MAPLD Conference)

 

B1: Jon Ewald
QuickLogic Corporation

"Military-Temperature Plastic FPGAs Provide Same Security, Performance and Reliability as Ceramic FPGAs at Half the Cost"

B1_Ewald.pdf

B1_Ewald.doc

As reduced military budgets drive the trend towards COT, designs that could previously only be addressed with higher-cost, ceramic-packaged FPGAs can
now be implemented with lower-cost, plastic-packaged parts. Members of QuickLogic's pASIC 1 and pASIC 3 families of plastic-packaged 5.0 or 3.3 volt devices, have been qualified and tested to operate over the industry standard military temperature range of -55° C to +125° C and offer users the same performance, security and reliability as ceramic-packaged military components. Featuring standby current consumption as low as 500uA resulting in standby power consumption of just 1.65mW, the plastic-packaged devices operate reliably at the extreme 125° C hot temperature specified for the industry-standard military-temperature range.


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