| Title, Authors, Reference, Link | Abstract, Summary, Conclusions |
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INTRODUCTION |
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| INTRODUCTION Whether designing digital logic at the board level or when designing an application specific circuit that is implemented in a gate array, designers should leave "margin." These extra logic resources include gates, flip-flops, RAM blocks, input/output cells, and other resources as applicable to the circuit technology being used. These resources enable logic device designers to readily respond to changing requirements, fix design errors, enable freedom to trade off resources and power and speed, as well as easing the routing of the chip. At the end of the project, however, this margin or reserve serves no useful purpose and they are going to be in the embedded system. This application note will suggest two ways in which these resources can be effectively used. | |
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Summary: A socket manufacturer's lids were found to be ESD "unfriendly." Alternate lids were ordered, from the same manufacturer, and were found to be ESD "friendly." |
NASA Advisory # NA-GSFC-2004-05 |
Problem Description and Details: A GSFC project had cable assembly failures due to shorted connectors. Trompeter Electronics, Inc. manufactured these COTS connectors per catalog p/n PL3155-47. A GSFC failure analysis determined that the connector failures were caused by a solder bump on the ring ferrule, which wore through the insulation sheath and shorted to the connector case. This solder bump protrusion is illustrated in Figures 1 and 2 on page 2. The root cause failure mechanism was attributable to poor GSFC workmanship during the connector assembly operation. Step 4B of the Trompeter Assembly Instruction TAI-125 requires the following: Solder white conductor to inner shield, between ridges, being careful not to allow solder to extend above ridges. As illustrated in Figure 3, the solder extended beyond the ridge line, thereby causing a solder protrusion into the insulation and a resultant shorting condition to case. |
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Abstract: When removing any part from a board that may be subjected to additional testing or analysis, it is very worthwhile to have the technician spend a bit of extra time removing the part with care, particularly with high pin-count leaded packages. As we can see from the photographs below, preparing this part for additional testing will be a challenge. |
February 25, 2004 |
Introduction Electroplating an object's surface with a thin layer of corrosion resistant material (e.g., tin, zinc) is a standard method of protecting mechanical parts against corrosion. Platings (e.g., tin-lead solder, tin, gold, palladium) are also used on electrical parts to protect against corrosion and improve their solderability. It has been known for more than fifty years that a tin layer plated on a surface will spontaneously grow hair-like single-crystal filaments known as "tin whiskers". These whiskers are electrically conductive and physically strong. |
NA-GSFC-2004-04 |
Problem Description and Details: During project reviews, the NASA Office of Logic Design has found instances of flight hardware that had microprocessors and FPGAs with improper configuration of the TRST* pin and the IEEE JTAG 1149.1 Interface. Therefore, it is essential that the designers, analysts, and reviewers read the attached technical article, which emphasizes the design fundamentals of the proper termination of the TRST* pin and the IEEE JTAG 1149.1 Interface. |
Timing Analysis of Asynchronous Signals |
Introduction |
Analysis of POR Circuit Topologies |
Abstract |
Asynchronous & Synchronous Reset Design Techniques - Part Deux Clifford E. Cummings, Don Mills, and Steve Golson |
Abstract |
Some Characteristics of Crystal Clock Oscillators During the Turn-On Transient |
Abstract |
RC Timing Notes |
Abstract |
TTL Compatible" Inputs in CMOS Devices |
Abstract: |
Joe Fabula, Xilinx |
Notes On Upscreening Components. |
Actel Corporation COTS and Up-Screening Policy |
Introduction |
| Xilinx
Upscreening Policy Joseph J. Fabula |
Abstract |
Kapton® Tape Identification NASA
Advisory NA-GSFC-2002-03 |
Problem Description and Details Kapton® tape is widely used throughout the electronics industry and at Goddard. There are two generally available adhesive systems, acrylic and silicone. The silicone based thermoset adhesive has been found to cause contamination and contamination related failures due to outgassing and surface migration of the silicone adhesive. There have been four cases where Kapton® tape with a silicone based adhesive has been detected at the Goddard Space Flight Center. |
Electrical Grounding Architecture for Unmanned Spacecraft NASA-HDBK-4001 |
FOREWORD This handbook was developed to describe electrical grounding design architecture options for unmanned spacecraft. This handbook is written for spacecraft system engineers, power engineers, and electromagnetic compatibility (EMC) engineers. Spacecraft grounding architecture is a system-level decision which must be established at the earliest point in spacecraft design. All other grounding design must be coordinated with and be consistent with the system-level architecture. This handbook assumes that there is no one single "correct" design for spacecraft grounding architecture. There have been many successful satellite and spacecraft programs from NASA, using a variety of grounding architectures with different levels of complexity. However, some design principles learned over the years apply to all types of spacecraft development. This handbook summarizes those principles to help guide spacecraft grounding architecture design for NASA and others. |
| Design, Analysis, and Test Guides | A collection of guidelines, analysis, and documents to aid in the design, analysis, and test of spaceborne electronics and systems. |
An Error Correction Code to Address Neutron Single Event Upsets in Semiconductor Memory David W. Jensen, Ph.D. Advanced Computing Systems Rockwell Collins Thirteenth Biennial Single Effects Symposium |
Introduction and Summary
Note: Could not make a .pdf file. (May 3, 2002) |
An Outline of Worst Case Analysis Requirements for Digital Electronics |
Abstract Every designers goal is mission success: the production of a correctly functioning system. One of the keys to achieving that goal is the worst case analysis (WCA). A detailed WCA, if performed during the design phase, can find design problems that may not be found during the test phase. Timing errors, interface margin problems, and other design flaws may manifest themselves only under limited operating conditions that are not present during test, such as temperature extremes, age, or radiation, or in limited operating modes that are not exercised in test. The only way to guarantee that no design flaws exist in a circuit is to carefully analyze the circuit and prove their absence. The purpose of a WCA is to prove the design will function as expected during its mission. The spirit of analysis is proof: all circuits are considered guilty of design flaws until proven innocent. The following is an outline of WCA requirements which introduces the circuit design items that must be reviewed as part of the WCA. |
Digital Timing Analysis Tools and Techniques |
Abstract The timing analysis is a crucial part of a digital systems worst case analysis. Every latched device has timing requirements -- set-up times, hold times, etc. - - that must be met in order to guarantee correct system operation, and the goal of the timing analysis is to determine whether they are met. Because each device input can have many sources whose timing can vary with circuit operation mode , the timing analysis can be very complicated and time consuming. Thus many attempts at automating the timing analysis task have been made. But, the task is sufficiently complex that attempts to fully automate it have, so far, had only limited success. This report examines several timing analysis methods, and discusses their strengths and weaknesses. |
Root-Sum-Square (RSS) Calculations of Digital Timing Delays |
Abstract The subject of RSS versus extreme value calculations arises often in worst case analyses because the calculation of a quantity, e.g., the delay of a digital parts chain, required to be less than some value, will yield a smaller result when calculated by the RSS method than by the extreme value method, making it easier to claim that requirements are met. The validity of RSS is often debated without exploring its mathematical basis. This report discusses the basis for RSS calculations and the methods limitations. Although the discussion is centered around calculating the propagation delays of digital circuits, the basic theory and conclusions apply to any application of RSS. |
| NASA Lessons Learned | The Lessons Learned Information System (LLIS) is a NASA-wide lessons
learned repository. The LLIS offers search capabilities to permit various searches (e.g.,
NASA Center, date, Project, search string, etc.). Additional catagorization capability is
under evaluation for future implementation by the LLIS Steering Committee. The NASA Lessons Learned url link will take you directly to the LLIS Home Page. |
| GCRs: Integral LET Spectra.pdf | Fluence vs. LET curves for a variety of orbits. (.pdf 27 kbytes) |
| socket_manufacturers.htm | |
| RadShielding1.htm | |
| MetastableStates.htm | |
| JTAG_SX_WhitePaper.PDF | "Use of SX Series Devices and IEEE 1149.1 JTAG Circuitry." This white paper reviews basic 1149.1 principles, radiation results on SX Series devices, and finishes with mitigation techniques and design considerations. (.pdf 629 kbytes) |
| StartupNote.pdf | Consideration of component characteristics during the startup transient. |
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Digital Engineering Institute
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